The U.S. Chamber of Commerce’ s U.S. India Business Council Global Private Limited (USIBC GPL) and the Department of Information Technology, Electronics & Communications (IT E&C), Government of Telangana, signed a Memorandum of Understanding (MOU) to bolster U.S.-India collaboration and partnership in technological innovation.
The MOU was signed in the presence of Chief Guest, Honourable Minister for Information Technology (IT), Electronics & Communications (E&C), Industries & Commerce (I&C), and Legislative Affairs, Shri D Sridhar Babu and Special Chief Secretary to the Government of Telangana for IT E&C and I&C, Shrit Jayesh Ranjan, Guest of Honour, Jennifer Larson, U.S. Consul General Hyderabad, and USIBC Managing Director Rahul Sharma.
The MoU outlines cooperation in key focus sectors including IT, Artificial Intelligence (AI), electronics and Global Capability Centers (GCCs). The signing was followed by an industry roundtable on AI and GCCs, reinforcing Hyderabad and Telangana’s role as a global technology hub.
Honourable Minister Shri D. Sridhar Babu noted, “Telangana has emerged as a global leader in innovation, and this MoU marks a new chapter in deepening our partnership with the United States. Our collaboration with USIBC is focused on driving investment, fostering innovation, and generating employment opportunities, paving the way for a future powered by cutting-edge technologies such as AI and GCCs.”
USIBC is thrilled to deepen technological ties between U.S. and Indian regional governments and pursue activities with industry under U.S.- India initiative on critical and emerging technologies (iCET). Launched at the U.S. Chamber of Commerce in January 2023, USIBC has worked closely with governments and industry in pursuing activities across iCET sectors including AI, semiconductors and electronics, advanced telecommunications, space tech, among other areas.
